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PCBuilder Micrometre PCB-G2G8 thermal paste, 2 g, with an 8.5 W/(m·K) conductivity reference and listed wipe, dust brush, scraper and manual.
R99.00
In stock with us — 8 avail
Clear fulfilment, warranty and payment details.
PCBuilder Micrometre · Thermal interface
The PCBuilder Micrometre PCB-G2G8 is a 2 g thermal-paste pack for the interface between a processor and a suitable heatsink. Its published thermal-conductivity reference is 8.5 W/(m·K), with basic cleaning and spreading accessories included.
At the interface
Thermal compound is used between a compatible component and heatsink to fill microscopic surface gaps. Cooler mounting, contact pressure and airflow still matter; a conductivity number alone does not predict a system’s operating temperature.
Formulation
The listed composition is 20% polydimethylsiloxane and 80% zinc/aluminium metal oxides. It is described as non-electrically-conductive. Keep compound away from unrelated contacts and follow the component and cooler instructions.
Prepare and apply
The listed pack includes a cleaning wipe, small dust brush, scraper and user manual. Clean and prepare the mating surfaces as the equipment instructions require, then use the appropriate quantity and mounting method for that cooler.
Understand the figures
The compound is listed for −50°C to 200°C operation. That range describes the material reference, not an acceptable temperature limit for every processor. Detailed viscosity and impedance figures are retained in Specifications with their source limitations.
Follow the hardware and cooler instructions. Thermal conductivity is a material reference, not a measured temperature improvement. Exact compound colour and some test-unit/measurement scopes require confirmation.
| Brand / model | PCBuilder Micrometre |
|---|---|
| SKU | PCB-G2G8 |
| Net paste-content reference | 2 g |
| Thermal-conductivity reference | 8.5 W/(m·K) |
| Electrical reference | Listed as non-electrically-conductive; not an independent safety certification |
| Composition reference | 20% polydimethylsiloxane silicone; 80% zinc oxide/aluminium oxide |
| Compound-colour reference | Grey in technical text; blue in additional-info field — supplied compound colour not independently established |
| Operating-temperature reference | −50°C to 200°C; material range, not a processor operating limit |
|---|---|
| Thermal-impedance reference | <0.135 °C·in²/W in exact distributor text; test method not provided |
| Viscosity reference | 75,000 ±2,000 mPa as published; time unit/test method not supplied |
| Specific-gravity reference | 2.6, as listed |
| Vdaf reference | <0.6% at200°C/24h; test definition not provided |
| Listed dimensions | 11×2×2 cm; syringe/package measurement scope requires confirmation |
| Contents | 1×2g thermal-paste pack;1×cleaning wipe;1×small dust brush;1×scraper;1×user manual |
|---|---|
| Warranty reference | 12 months; applicable terms apply |
Follow the hardware and cooler instructions. Thermal conductivity is a material reference, not a measured temperature improvement. Exact compound colour and some test-unit/measurement scopes require confirmation.
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